Finite Element Simulation Study of the Effects of Kirkendall Voids in IMC Layer on Interfacial Crack and Reliability of Cu–Sn Solder Joint
Author:
Affiliation:
1. South China University of Technology,Guangdong Provincial Engineering Technology R&D Center of Electronic Packaging Materials & Reliability, School of Materials Science & Engineering,Guangzhou,China,510640
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492349.pdf?arnumber=10492349
Reference8 articles.
1. Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks
2. Recent progress in SLID bonding in novel 3D-IC technologies
3. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock
4. Assessing the risk of “Kirkendall voiding” in Cu3Sn
5. Investigation on the thermal degradation mechanism of Cu-Sn intermetallic compound in SAC solder joints with Cohesive Zone modeling
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