Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder-Reference-Cited by-同舟云学术

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Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

Published:2012-02 Issue:2 Volume:177 Page:197-204
ISSN:0921-5107
Container-title:Materials Science and Engineering: B
language:en
Short-container-title:Materials Science and Engineering: B

Author:

Koppes John P.,Grossklaus Kevin A.,Muza Anthony R.,Revur R. Rao,Sengupta Suvankar,Rae Alan,Stach Eric A.,Handwerker Carol A.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference36 articles.

1. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

2. Lead-free Soldering;Bath,2007

3. Handbook of Lead-free Solder Technology for Microelectronic Assemblies;Puttlitz,2004

4. Size-dependent melting properties of tin nanoparticles

5. Synthesis and Thermal and Wetting Properties of Tin/Silver Alloy Nanoparticles for Low Melting Point Lead-Free Solders

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation and characterization of nano-solder paste with high nanoparticle loading and their thermal and printing properties;Materials Chemistry and Physics;2023-03

2. Interfacial and volumetric melting regimes of Sn nanoparticles;Acta Materialia;2022-08

3. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties;Materials & Design;2022-03

4. Effect of Sn nanoparticle additions on thermal properties of Sn-Ag-Cu lead-free solder paste;Thermochimica Acta;2020-08

5. Recent advances in nano-materials for packaging of electronic devices;Journal of Materials Science: Materials in Electronics;2019-07-18

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