Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module-Reference-Cited by-同舟云学术

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Optimal thermal design of a horizontal fin heat sink with a modified-opening model mounted on an LED module

Published:2015-12 Issue: Volume:91 Page:105-115
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Jeong Min Woo,Jeon Seung Won,Kim Yongchan

Funder

Korean government (MSIP)

Korea Government Ministry of Trade, Industry and Energy

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference33 articles.

1. Heat dissipation design and analysis of high power LED array using the finite element method;Cheng;Microelectron. Reliab.,2012

2. Development of a thermal resistance model for chip-on-board packaging of high power LED arrays;Ha;Microelectron. Reliab.,2012

3. Thermal effects in packaging high power light emitting diode arrays;Christensen;Appl. Therm. Eng.,2009

4. Orientation effects on natural convection heat dissipation of rectangular fin heat sinks mounted on LEDs;Shen;Int. J. Heat Mass Transfer,2014

5. Optimum design of a radial heat sink with a fin-height profile for high-power LED lighting applications;Jang;Appl. Energy,2014

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2. Experimental Study on the Effect of In/Out Radial-Finned Heat Sink with PCM under Constant and Intermittent Power Mode in Power LEDs;International Journal of Photoenergy;2023-12-22

3. Thermal Performance of AlN-Coated High-Power LED Optimized Using Taguchi Statistical Approach;Journal of Electronic Materials;2023-03-17

4. Thermal improvement of the vertical plate-fin heat sink by variable fin thickness pattern and utilizing phase change material: A numerical investigation;Journal of Energy Storage;2023-03

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