Development of a thermal resistance model for chip-on-board packaging of high power LED arrays-Reference-Cited by-同舟云学术

Development of a thermal resistance model for chip-on-board packaging of high power LED arrays

Published:2012-05 Issue:5 Volume:52 Page:836-844
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ha Minseok,Graham Samuel

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference24 articles.

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3. Cree. Cree XLamp LED thermal management. Cree, Inc. 2006. .

4. OSRAM. Thermal management of golden DRAGON LED, application note; 2008.

5. Petroski J. Spacing of high-brightness LEDs on metal substrate PCB’s for proper thermal performance. In: Thermal and thermomechanical phenomena in electronic systems, 2004. ITHERM ’04. The ninth intersociety conference on; 2004.

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