Thermal effects in packaging high power light emitting diode arrays

Author:

Christensen Adam,Graham Samuel

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference26 articles.

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3. N. Narendran, Y. Gu, R. Hosseinzadeh, Estimating junction temperature of high-flux white LEDs, in: Proceedings of SPIE – The International Society for Optical Engineering, San Jose, CA, United States, 2004, pp. 158–160.

4. M. Arik, C. Becker, S. Weaver, J. Petroski, Thermal management of LEDs: package to system, in: Proceedings of SPIE – The International Society for Optical Engineering, San Diego, CA, United States, 2004, pp. 64–75.

5. J. Petroski, Spacing of high-brightness LEDs on metal substrate PCB’s for proper thermal performance, in: Thermomechanical Phenomena in Electronic Systems – Proceedings of the Intersociety Conference, Las Vegas, NV, United States, 2004, pp. 507–514.

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