Wafer Level Packaging Technology for Optical Imaging Sensors
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference5 articles.
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2. A., Badihi et al., “Ultrathin wafer level chip size package”, IEEE Trans. On Advanced Packaging, vol. 23, No. 2, May 2000, pp. 212-214.
3. T. Noma et al., “Semiconductor device and manufacturing method there of”, US Patent 2003/0230805 A1, 2003.
4. J. Leib et al., “New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications”, Digest Tech. Papers ECTC 2004 Conference. Las Vegas, USA, 2004.
5. H.-D. Ngo et al, “Plasma etching of tapered features in silicon for MEMS and Wafer Level Packaging Applications”, Conference Proceeding iMEMS, Singapore 2006, pp. 271-276.
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