Morphology and interfacial properties of microrelief metal–semiconductor interface-Reference-Cited by-同舟云学术

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Morphology and interfacial properties of microrelief metal–semiconductor interface

Published:2002-05 Issue:1-4 Volume:190 Page:455-460
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Dmitruk N.L.,Borkovskaya O.Yu.,Dmitruk I.N.,Mamykin S.V.,Horvath Zs.J.,Mamontova I.B.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference8 articles.

1. Texturized interface as a basis of surface-barrier heterostructure for solar cells application

2. Ultraviolet photodetector on the basis of heterojunction with textured interface

3. Studies of tunnel MOS diodes II. Thermal equilibrium considerations

4. Evaluation of the interface state energy distribution from SchottkyI‐Vcharacteristics

5. O.Yu. Borkovskaya, T.Ya. Gorbach, N.L. Dmitruk, O.N. Mishchuk, Elektronnaya Tekhnika Ser. 2, N5 (1989) 50 (in Russian).

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