A quantitative adhesion study between contacting materials in Cu damascene structures-Reference-Cited by-同舟云学术

A quantitative adhesion study between contacting materials in Cu damascene structures

Published:2002-11 Issue:1-4 Volume:201 Page:20-34
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Lanckmans F,Brongersma S.H,Varga I,Poortmans S,Bender H,Conard T,Maex K

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference15 articles.

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3. S.R. Wilson, C.J. Tracy, J.L. Freeman, Handbook of Metallisation for Integrated Circuits, Noyes Publications, NJ, 1996.

4. Properties of a ‐ SiO x : H Thin Films Deposited from Hydrogen Silsesquioxane Resins

5. G. De Roeck, The Finite Element Method, Acco, Leuven, 1993.

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