Fabrication of Copper Damascene Patterns on Polyimide Using Direct Metallization on Trench Templates Generated by Imprint Lithography-Reference-Cited by-同舟云学术

Fabrication of Copper Damascene Patterns on Polyimide Using Direct Metallization on Trench Templates Generated by Imprint Lithography

Published:2010-06-17 Issue:14 Volume:26 Page:12448-12454
ISSN:0743-7463
Container-title:Langmuir
language:en
Short-container-title:Langmuir

Author:

Matsumura Yasufumi¹,Enomoto Yasushi¹,Tsuruoka Takaaki²,Akamatsu Kensuke²,Nawafune Hidemi²

Affiliation:

1. Basic Research Laboratories, Nippon Steel Chemical Co., Ltd. 1-Tsukiji, Kisarazu, Chiba 292-0835, Japan

2. Department of Nanobiochemistry, Frontiers of Innovative Research in Science and Technology (FIRST), Konan University, 7-1-20 Minatojimaminami, Chuo-ku, Kobe 650-0047, Japan

Publisher

American Chemical Society (ACS)

Subject

Electrochemistry,Spectroscopy,Surfaces and Interfaces,Condensed Matter Physics,General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/la101350f

Reference38 articles.

1. Micro- and Nanopatterning Techniques for Organic Electronic and Optoelectronic Systems

2. New Approaches to Nanofabrication: Molding, Printing, and Other Techniques

3. Fabrication Approaches for Generating Complex Micro- and Nanopatterns on Polymeric Surfaces

4. Damascene copper electroplating for chip interconnections

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