Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference14 articles.
1. Abrasive Machining of Silicon;Toenshoff;Annals of the CIRP,1990
2. Development of Single Step Grinding System for Large Scale 300 Si Wafer;Eda;Annals of the CIRP,2001
3. State-of-the-art Technologies and Kinematical Analysis for One-Stop Finishing of 300mm Si Wafer;Zhou;Journal of Materials Processing Technologies,2002
4. Modelling and Simulation of the Rotational Grinding Process;Ahearne,2005
5. Measurement of Locally Varying Forces in Rotational Grinding;Gangawane,2006
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献