State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer-Reference-Cited by-同舟云学术

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State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

Published:2002-10 Issue:1-3 Volume:129 Page:34-40
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Zhou L.B,Eda H,Shimizu J

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference5 articles.

1. Abrasive machining of silicon;Tönshoff;Ann. CIRP,1990

2. JSME: Principle of Manufacturing Technology, Nikkan-Kogyo Shinbunsha, 1998, p. 23.

3. Y. Taniguchi, Nano-technology, Kogyo Chosakai, 1988, p. 104.

4. Preisach modelling of magnetostrictive hysteresis;Adly;J. Appl. Phys.,1991

5. K. Kimura, et al., Characteristics of CMP using hard wheel pad, Proc. JSPE (1988) 245 (in Japanese).

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