An extensive survey on reduction of noise coupling in TSV based 3D IC integration
Author:
Publisher
Elsevier BV
Subject
General Medicine
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3. Design and Performance Analysis of 3D IC Integration Model for High Frequency and RF Applications;2023 International Conference on Computational Intelligence for Information, Security and Communication Applications (CIISCA);2023-06-22
4. Substrate noise evaluation for lightly doped 45nm N-MOSFET using physical simulation models;International Journal of Electronics;2023-02-20
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