Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer-Reference-Cited by-同舟云学术

Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Published:2017-05 Issue: Volume:194 Page:86-89
ISSN:0167-577X
Container-title:Materials Letters
language:en
Short-container-title:Materials Letters

Author:

Panigrahi Asisa Kumar,Ghosh Tamal,Vanjari Siva Rama Krishna,Singh Shiv Govind

Funder

Deity

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference16 articles.

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2. High-Density 3-D Interconnect of Cu–Cu Contacts With Enhanced Contact Resistance by Self-Assembled Monolayer (SAM) Passivation

3. Copper wafer bonding;Fan;Electrochem. Soild-State Lett.,1999

4. Silicon multilayer stacking based on copper wafer bonding;Tan;Electrochem. Solid-State Lett.,2005

5. Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics;Park;Appl. Surf. Sci.,2015

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