1. A. Heinig, M. Dietrich, A. Herkersdorf, F. Miller, T. Wild, K. Hahn, A. Grunewald, R. Bruck, S. Krohnert, J. Reisinger, Des. Autom. Test Eur. Conf. Exhib. (DATE14). (2014).
2. Recent developments in MEMS sensors: a review of applications, markets and technologies
3. W. Arden, M. Brillouët, P. Cogez, M. Graef, B. Huizing, R. Mahnkopf, J. Pelka, J.U. Pfeiffer, A. Rouzaud, M. Tartagni, C. Van Hoof, J. Wagner. “More-than-Moore” roadmap, (2011) 1–131.
4. Handbook of Silicon Based MEMS Materials and Technologies;Lindroos,2015
5. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures