Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding-Reference-Cited by-同舟云学术

Investigation of the microstructural evolution and detachment of Co in contact with Cu–Sn electroplated silicon chips during solid-liquid interdiffusion bonding

Published:2022-01 Issue: Volume:890 Page:161852
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Emadi F.,Vuorinen V.,Dong H.,Ross G.,Paulasto-Kröckel M.

Funder

Aalto-Yliopisto

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference49 articles.

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3. Microstructural characterization and mechanical performance of wafer-level SLID bonded Au-Sn and Cu-Sn seal rings for MEMS encapsulation;Rautiainen;J. Electron. Mater.,2015

4. Cu-Sn intermetallic compound joints for high-temperature power electronics applications;Lee;J. Electron. Mater.,2018

5. Void formation and intermetallic growth in pulse electrodeposited Cu-Sn layers for MEMS packaging;Kannojia;J. Electron. Mater.,2018

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1. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2024

2. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08

3. Accelerated Solid-Liquid Interdiffusion Bonding of Cu Joint Using a Cu10ni Alloy Mesh Reinforced Sac305 Composite Solder;2023

4. Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer;Journal of Alloys and Compounds;2022-12

5. Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13