Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate-Reference-Cited by-同舟云学术

Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate

Published:2021 Issue: Volume:46 Page:1101-1105
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Sonawane Pushkaraj D.^ORCID,Bupesh Raja V.K.,Gupta Manoj

Publisher

Elsevier BV

Subject

General Medicine

Reference24 articles.

1. P. D. Sonawane, V. K. Bupesh Raja, International Conference on Frontiers in Automobile & Mechanical Engineering (FAME 2020), AIP Conference Proceedings 2311, 080003 (2020), pp 080003-1-080003-6.

2. Directional Solidification of Sn-Cu6Sn5 In Situ Composites

3. W. R. Osorio, E. S. Freitas, J. E. Spinelli, A. Garcia, Corrosion Science, 80 (2014) 71-81.

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