A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-1457-7_62
Reference15 articles.
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3. Shalaby RM et al (2018) Design and properties of new lead-free solder joints using Sn-3.5Ag–Cu solder. Silicon 10(5):1861–1871
4. Ke JH et al (2016) Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates—a simulation study. Acta Mater 113:245–258
5. Liu X, He S, Nishikawa H (2017) Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attach. J Alloy Compd 695:2165–2172
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