Effect of Thermomechanical Treatment on Microstructural and Localized Micromechanical Properties of Sn–0.7Cu Solder Alloy
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-9267-4_15
Reference33 articles.
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3. A.M. Afdzaluddin, M.A. Bakar, Effect of coating element on joining stability of Sn–0.3Ag–0.7Cu solder joint due to aging test. Sains Malaysiana 49, 3045–3054 (2020). https://doi.org/10.17576/jsm-2020-4912-16
4. B. Ali, M.F.M. Sabri, I. Jauhari, N.L. Sukiman, Impact toughness, hardness and shear strength of Fe and Bi added Sn–1Ag–0.5Cu lead-free solders. Microelectron. Reliab. 63, 224–230 (2016). https://doi.org/10.1016/j.microrel.2016.05.004
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