Thermal degradation of anisotropic conductive film joints under temperature fluctuation-Reference-Cited by-同舟云学术

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Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Published:2008-09 Issue:6 Volume:28 Page:314-320
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Kim Jong-Woong,Koo Ja-Myeong,Lee Chang-Yong,Noh Bo-In,Yoon Jeong-Won,Kim Dae-Gon,Park Sun-Kyu,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference11 articles.

1. Microelectronic packaging;Datta,2005

2. Evaluation of solder joint reliability in flip-chip packages during accelerated testing

3. Behaviour of anisotropic conductive joints under mechanical loading

4. Investigations of the test parameters and bump structures in the shear test of flip chip solder bump

5. Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

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1. Experimental study of mechanical-capillary driven phase-change loop for heat dissipation of electronic devices and batteries;Applied Thermal Engineering;2022-06

2. Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test;Microelectronics Reliability;2020-09

3. Electrical evaluations of anisotropic conductive film manufactured by electrohydrodynamic ink jet printing technology;Organic Electronics;2020-03

4. Reliability and Failure Analysis of UHF RFID Passive Tags Under Thermal Storage;IEEE Transactions on Device and Materials Reliability;2017-09

5. Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding;ETRI Journal;2016-12

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