Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis-Reference-Cited by-同舟云学术

Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis

Published:2004-04 Issue:2 Volume:24 Page:135-142
ISSN:0143-7496
Container-title:International Journal of Adhesion and Adhesives
language:en
Short-container-title:International Journal of Adhesion and Adhesives

Author:

Kwon Woon-Seong,Paik Kyung-Wook

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference4 articles.

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2. Yim MJ, Paik KW, Kim YK, Hwang HN. A study on the electrical conduction mechanism of anisotropically conductive film for LCD packaging application. In: Advances in electronic packaging, International Electronic Packaging Technical Conference and Exhibition (Inter PACK), vol. 19-1. New York: EEP; 1997. p. 65–72.

3. Experimental characterization and theoretical characterization of electrical contact in anisotropically conductive adhesives;Fu;IEEE Trans CPMT B: Adv Packaging,2000

4. Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates;Lai;IEEE Trans CPMT B: Adv Packaging,1996

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