Electrical Industry

Author:

Kim Kwang-Seok,Kim Jong-Woong,Jung Seung-Boo

Publisher

Springer International Publishing

Reference42 articles.

1. Amoli BM, Trinidad J, Hu A, Zhou YN et al (2015) Highly electrically conductive adhesives using silver nanoparticle(Ag NP)-decorated graphene: the effect of NPs sintering on the electrical conductivity improvement. J Mater Sci: Mater Electron 26:590–600

2. Aschenbrenner R et al (1997) Adhesive flip chip bonding on flexible substrates. In: Proceedings of 1st IEEE international symposium on polymeric electronics packaging, IEEE, p 86

3. Chen C, Wang L, Li R et al (2007) Effect of silver nanowires on electrical conductance of system composed of silver particles. J Mater Sci 42:3172–3176

4. Chen D, Qiao X, Qiu X et al (2010) Effect of silver nanostructures on the resistivity of electrically conductive adhesives composed of silver flakes. J Mater Sci: Mater Electron 21:486–490

5. Chueh TC, Hu CH, Yen SC (2015) Electrically conductive adhesives with low Ag content prepared by Ag self-activated plating and PEDOT:PSS. J Electrochem Soc 162:D56–D61

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