Electrically Conductive Adhesives with Low Ag Content Prepared by Ag Self-Activated Plating and PEDOT:PSS

Author:

Chueh Ti-Chiang,Hu Chi-Hsien,Yen Shi-Chern

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. Lau J. H. , Solder joint reliability: theory and applications. Springer (1991).

2. Liong S. Wong C. P. Burgoyne W. F. Jr. “Conductivity improvement of thermoplastic isotropically conductive adhesive.,” in Electronic Components and Technology Conference, 2002. Proceedings. 52nd. (2002).

3. High conductivity of isotropic conductive adhesives filled with silver nanowires

4. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives

5. Effects of shrinkage on conductivity of isotropic conductive adhesives

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