Author:
Wu H.P.,Liu J.F.,Wu X.J.,Ge M.Y.,Wang Y.W.,Zhang G.Q.,Jiang J.Z.
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference15 articles.
1. Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications;Rasul;Microelectron Reliab,2004
2. Li Y, Kyoung-sik M, Li HY, Wong CP. Development of isotropic conductive adhesives with improved conductivity. Ninth international symposium on advanced packaging materials 2004, p. 1–6.
3. Development of conducting adhesive materials for microelectronic applications;Kang;J Electron Mater,1999
4. Isotropic conductive adhesives filled with low-melting-point alloy filler;Lu;IEEE Trans Electron Packag Manuf,2000
5. High performance conductive adhesives;Lu;IEEE Trans Electron Packag Manuf,1999
Cited by
139 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献