Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding

Author:

Lee Haksun,Choi Kwang-Seong,Eom Yong-Sung,Bae Hyun-Cheol,Lee Jin Ho

Funder

Electronics and Telecommunications Research Institute

Ministry of Science, ICT and Future Planning

Korea Research Council for Industrial Science and Technology

Development of an image-based, real-time inspection, and isolation system for hyperfine faults

Publisher

Wiley

Subject

Electrical and Electronic Engineering,General Computer Science,Electronic, Optical and Magnetic Materials

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