Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference13 articles.
1. Watanabe I, et al. In: Proceedings Asia Display/IDW, 2001. p. 553.
2. Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display
3. A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive
4. Clot P, Zeberli JF, Chenuz JM, Ferrando F, Styblo D. In: Proceedings electronics manufacturing technology symposium, 24th IEEE/CPMT; 1999. p. 36
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