Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Author:
Affiliation:
1. ETRI,Superintelligence Creative Research Laboratory,Daejeon,Republic of Korea
2. ETRI,Superintelligence Creative Research Laboratory,Daejeon,South Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418338.pdf?arnumber=10418338
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1. 59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
2. 74‐4: Development of Flexible Full‐Color Mini‐LED Display Using Simultaneous Transfer and Bonding (SITRAB) Technology
3. Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display
4. The contact resistance and reliability of anisotropically conductive film (ACF)
5. Packaging Technologies using Anisotropic Conductive Adhesive Films in FPDs;Watanabe;Proc. Asia Display/IDW,2001
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