Author:
Tan C.W.,Chan Y.C.,Yeung N.H.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Statistic of electric conductance through anisotropically conductive adhesive;Fu;IEEE Trans. Component Packaging Technol.,2000
2. Chang DD, Fulton JA, Lyons AM, Nis JR. Design considerations for the implementation of anisotropically conductive adhesive interconnections. In: Proceedings of Nepcon W., 1992. p. 1381
3. Design and understanding of anisotropic conductive films (ACFs) for LCD packaging;Yim;IEEE Trans. Component Packaging Technol.––Part A,1998
4. Nagai A, Takemure K, Isaka K, Watanabe O, Kojima K, Matsuda K, Watanabe I. Anisotropic conductive adhesive films for flip chip interconnection onto organic substrates. In: Proceedings of IEMT/IMC, 1998. p. 353–7
5. Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear;Fan;IEEE Trans. Adv. Packaging,2001
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献