Author:
Li Ming,Guo Xiaoguang,Kang Renke,Guo Dongming,Zhou Ping
Subject
Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials
Reference57 articles.
1. Materials: silicon and beyond [J];Ando;Sens Actuators A: Phys,2019
2. Repairing slight damages on monocrystalline silicon surface by thermal annealing [J];Feng;Mater Res Express,2021
3. Park S., Kang S., Shin Y., et al. Stress-less Dicing Solution for Thin and Large Die Handling for 2.5 D/3D IC Packaging [C]// 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), IEEE, 2022, 183–186.
4. An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing [J];Li;J Mater Process Technol,2022
5. Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process [J];Zhang;Curr Appl Phys,2019
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献