Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging
Author:
Affiliation:
1. Samsung Electronics,Hwaseong-si,Gyeonggi-do,Republic of Korea
2. Joongwoo M-Tech,Danwon-gu,Ansain-si Gyeonggi-do,Korea,15420
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013271.pdf?arnumber=10013271
Reference5 articles.
1. Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
2. Key Properties for Successful Ultra Thin Die Pickup
3. Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
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1. Study on the transformation and control mechanism of amorphous damage during the grinding process of monocrystalline silicon considering grain shapes by MD method;Tribology International;2023-09
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