Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools-Reference-Cited by-同舟云学术

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Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools

Published:2016-12 Issue: Volume:104 Page:191-203
ISSN:0301-679X
Container-title:Tribology International
language:en
Short-container-title:Tribology International

Author:

Luo Qiufa,Lu Jing,Xu Xipeng

Funder

National Natural Science Foundation of China

Specialized Research Fund for the Doctoral Program of Higher Education

Promotion Program for Young and Middle-aged Teacher in Science and Technology Research of Huaqiao University

Graduates Cultivation Project of Huaqiao University for Research and Innovation Ability

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference42 articles.

1. Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer;Lee;J Nanosci Nanotechnol,2012

2. Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates;Kim;Wear,2013

3. Ultraprecision CMP for sapphire, GaN, and SiC for advanced optoelectronics materials;Aida;Curr Appl Phys,2012

4. Application of electronic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard-brittle materials used in light-emitting diodes;Lee;J Cryst Growth,2011

5. In situ monitoring and depth-resolved characterization of wet wear of silicon carbide;Presser;Wear,2011

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1. Simulation and experimental study of tool passivation based on magnetic elastic abrasive particles;Tribology International;2025-01

2. Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics;Tribology International;2024-12

3. Machining performance and material removal mechanism of sapphire with novel polishing slurry;Applied Surface Science;2024-10

4. Study on the polishing performance and mechanism of sapphire wafers by different types of degradable surfactants;Surfaces and Interfaces;2024-09

5. In-situ reconditioning mechanism for fixed abrasive pads based on the wear behavior of loose grains;Precision Engineering;2024-06

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