Machining performance and material removal mechanism of sapphire with novel polishing slurry
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference40 articles.
1. Effect of different grinding strategies on subsequent polishing processes of sapphire;Wang;J. Manuf. Process.,2024
2. Chemical mechanical polishing for sapphire wafers using a developed slurry;Zhang;J. Manuf. Process.,2021
3. Study on process optimization of ultrasound assisted magneto-rheological polishing of sapphire hemisphere surface based on Fe3O4/SiO2 core-shell abrasives;Zhai;Tribol. Int.,2023
4. Nd3+-doped colloidal SiO2 composite abrasives: synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers;Liu;Appl. Surf. Sci.,2017
5. Fe-Nx/C assisted chemical–mechanical polishing for improving the removal rate of sapphire;Xu;Appl. Surf. Sci.,2015
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