New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing-Reference-Cited by-同舟云学术

New insights into fracture of Si in Cu-filled through silicon via during and after thermal annealing

Published:2020-10 Issue: Volume:238 Page:107281
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Sonawane Dipali,Kumar Praveen

Funder

Department of Science and Technology

Ministry of Science and Technology

Indian National Science Academy

Indian Institute of Science

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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