Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles-Reference-Cited by-同舟云学术

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Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles

Published:2024-08 Issue: Volume:997 Page:174847
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Cai Zhiyong,Wen Jing,Wang Richu,Feng Yan,Peng Xiang,Li Xinxing,Li Ziming,Kang Zhijie,Zhang Xiaodi

Publisher

Elsevier BV

Reference45 articles.

1. Advanced materials for thermal management of electronic packaging;Tong,2011

2. Alloy development for highly conductive thermal management materials using copper-diamond composites fabricated by field assisted sintering technology;Rape;J. Mater. Sci.,2013

3. Influence evaluation of tungsten content on microstructure and properties of Cu-W composite;Li;Metals,2022

4. Fabrication of homogeneous Mo-Cu composites using spherical molybdenum powders prepared by thermal plasma spheroidization process;Li;Int. J. Refract. Met. H.,2018

5. Numerical and experimental research on fluid fow, solidification, and bonding strength during the twin-roll casting of Cu/Invar/Cu clad strips;Ji;Metall. Mater. Trans. B.,2020

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