A cyclic viscoplastic and creep damage model for lead free solder alloys
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference23 articles.
1. Creep deformation characteristics of tin and tin-based electronic solder alloys;Mathew;Metall Mater Trans A,2005
2. Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders;Wiese;Microelectron Reliab,2004
3. Some mechanical properties of Sn–3.5Ag eutectic alloy at different temperatures;El-Bahay;J Mater Sci: Mater Electron,2004
4. Surface damage accumulation in Sn–Ag solder joints under large reversed strains;Howell;J Mater Sci: Mater Electron,2002
5. Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder;Kanchanomai;Solder Surf Mount Technol,2002
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1. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints;Materials;2022-12-16
2. An integrated unified elasto-viscoplastic fatigue and creep damage model with characterization method for structural analysis of nickel-based high-temperature structure;International Journal of Damage Mechanics;2022-09-13
3. Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder;Microelectronics Reliability;2021-05
4. Effect of solder joint size and composition on liquid-assisted healing;Microelectronics Reliability;2021-04
5. A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions;Microelectronics Reliability;2021-04
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