Author:
Yang Hung-Chun,Chiu Tz-Cheng
Funder
Taiwan Ministry of Science and Technology
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference48 articles.
1. Properties of LEAD-free Solders. Database for Solder Properties With Emphasis on NEW LEAD-free Solders. Release 4.0;Siewert,2002
2. A review of mechanical properties of lead-free solders for electronic packaging;Ma;J. Mater. Sci.,2009
3. Stress relaxation characterization of hypoeutectic Sn3.0Ag0.5Cu Pb-free solder: experiment and modeling;Guddalorepatta,2007
4. Mechanical fatigue of Sn-rich Pb-free solder alloys;Shang;J Mater Sci-Mater El,2007
5. Low cycle fatigue test for solders using non-contact digital image measurement system;Kanchanomai;Int. J. Fatigue,2002
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献