Electrochemical spectroscopic analysis of additives in copper plating baths by DRT and multivariate approach-Reference-Cited by-同舟云学术

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Electrochemical spectroscopic analysis of additives in copper plating baths by DRT and multivariate approach

Published:2024-02 Issue: Volume:954 Page:118045
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Verrucchi Margherita^ORCID,Comparini Andrea,Bonechi Marco^ORCID,del Pace Ivan,Zangari Giovanni,Giurlani Walter^ORCID,Innocenti Massimo^ORCID

Funder

Ministero dell'Istruzione dell'Università e della Ricerca

Publisher

Elsevier BV

Reference36 articles.

1. The hull cell;Gabe;Trans. IMF,1993

2. Recent trends in copper metallization;Kim;Electronics,2022

3. The chemistry of additives in damascene copper plating;Vereecken;IBM J. Res. Dev.,2005

4. The Copper Damascene Process and Chemical Mechanical Polishing;Gupta,2009

5. Electroplating: applications in the Semiconductor Industry;Jhothiraman;Adv. Chem. Eng. Sci.,2019

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1. Clarifying the mechanism of actions of suppressor, brightener and sodium chloride in acid copper electrodeposition: A multidisciplinary approach for a many variable problem;Journal of Electroanalytical Chemistry;2024-11

2. On the Electrochemical Growth of a Crystalline p–n Junction From Aqueous Solutions;Chemistry – A European Journal;2024-07-11

3. What Is the Current State of Sustainability in the Decorative Electroplating Industry? A Close Look at New Practices and Advances;Sustainability;2024-07-08

4. Evaluating Copper Plating Process for Filling Micro Vias with Thin Surface Cu by the 1-(4-Carboxyphenyl)-5-Mercapto-1h-Tetrazole Additive;2024

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