The morphological evolution and migration of inclusions in thin-film interconnects under electric loading
Author:
Funder
National Science Foundation of China
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference40 articles.
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2. Phase field simulation of the inclusion instability and splitting processes in interconnects due to interface diffusion induced by electromigration;Journal of Mechanics of Materials and Structures;2023-03-24
3. Finite element simulation of inclusion evolution in interconnects due to electromigration-induced interface diffusion;Archive of Applied Mechanics;2022-11-15
4. Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration;European Journal of Mechanics - A/Solids;2022-07
5. Finite-element simulation of a phase-field model for inclusion electromigration in {110}-oriented single crystal metal interconnects due to interface diffusion anisotropy;Applied Physics A;2022-06-27
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