Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference17 articles.
1. Interdiffusion and reaction in bimetallic Cu–Sn thin films;Tu;Acta Metallurgica,1973
2. The growth of intermetallic compounds on common basis materials coated with tin and tin–lead alloys;Kay;Transactions of the Institution of Metal Finishing,1976
3. Interdiffusion and formation of intermetallic compounds in tin–copper alloy surface coatings;Revay;Surface Technology,1977
4. Cu–Sn intermetallic compound growth in hot-air-levelled tin at and below 100°C;Haimovich;AMP Journal of Technology,1993
5. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders – part I, experimental analysis;Vianco;Journal of Electronic Materials,1994
Cited by 107 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples;Journal of the Taiwan Institute of Chemical Engineers;2024-02
2. Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations;Corrosion Science;2024-01
3. Experimental investigation and thermochemical calculations in Ni-Sn and Ni-Sn-Zn systems;PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON MATHEMATICAL SCIENCES AND TECHNOLOGY 2022 (MATHTECH 2022): Navigating the Everchanging Norm with Mathematics and Technology;2024
4. Interfacial diffusion and Kirkendall voids evolution in the Copper-Zinc alloy binary interface revealed by in situ transmission electron microscopy;Journal of Alloys and Compounds;2023-12
5. Comparison of interfacial reactions and isothermal aging of cone Ni-P and flat Ni-P with Sn3.5Ag solders;Applied Surface Science;2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3