Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatings-Reference-Cited by-同舟云学术

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Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatings

Published:1977-01 Issue:1 Volume:5 Page:57-63
ISSN:0376-4583
Container-title:Surface Technology
language:en
Short-container-title:Surface Technology

Author:

Révay L.

Publisher

Elsevier BV

Subject

General Engineering

Reference12 articles.

1. A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its Alloys

2. Interdiffusion and reaction in bimetallic Cu-Sn thin films

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A High Voltage Aqueous Zinc–Vanadium Redox Flow Battery with Bimodal Tin and Copper Clusters by a Continuous-Flow Electrometallic Synthesis;ACS Applied Materials & Interfaces;2023-01-30

2. Studies of Cu-Sn interdiffusion coefficients in Cu3Sn and Cu6Sn5 based on the growth kinetics;Scripta Materialia;2021-11

3. Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review;Metals and Materials International;2021-01-11

4. Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps;Electronic Materials Letters;2019-06-07

5. Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures;Microelectronics Reliability;2012-09

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