Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps-Reference-Cited by-同舟云学术

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Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps

Published:2019-06-07 Issue:5 Volume:15 Page:562-571
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Ren Siru,Sun Menglong,Jin Zebin,Guo Yukun,Ling Huiqin,Hu An-min,Li Ming

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s13391-019-00154-7.pdf

Reference32 articles.

1. Tu, K.N.: Reliability challenges in 3D IC packaging technology. Microelectron. Reliab. 51, 517–523 (2011). https://doi.org/10.1016/J.MICROREL.2010.09.031

2. Ladani, L.J.: Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits. Microelectron. Eng. 87, 208–215 (2010). https://doi.org/10.1016/J.MEE.2009.07.022

3. Meinshausen, L., Weide-Zaage, K., Frémont, H.: Migration induced material transport in Cu–Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51, 1860–1864 (2011). https://doi.org/10.1016/j.microrel.2011.06.032

4. Liu, Y., Chu, Y.-C., Tu, K.N.: Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter. Acta Mater. 117, 146–152 (2016). https://doi.org/10.1016/J.ACTAMAT.2016.07.004

5. Wang, D., Ling, H., Sun, M., Miao, X., Hu, A., Li, M., Dai, F., Zhang, W., Cao, L.: Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps. J. Mater. Sci. Mater. Electron. 29, 1861–1867 (2018). https://doi.org/10.1007/s10854-017-8096-7

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1. Void Growth and Intermetallic Bridging in Microscale Solder Interconnects Under Thermal Annealing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

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3. Diffusion barrier property of Co-W layer compared with Ni layer in fine pitch micro-bumps during high temperature storage;Materials Letters;2023-09

4. Review on the electrodeposition and properties of high-density chip interconnection;SCIENTIA SINICA Chimica;2023-08-23

5. Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading;Materials;2023-07-26

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