Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study-Reference-Cited by-同舟云学术

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Electromigration effect upon single- and two-phase Ag-Cu alloy strips: An in situ study

Published:2019-12 Issue: Volume:173 Page:134-138
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Liu Yu-chen,Yu Yung-si,Lin Shih-kang,Chiu Shang-Jui

Funder

Ministry of Science and Technology, Taiwan

National Synchrotron Radiation Research Center

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference24 articles.

1. 3D Microelectronic Packaging. Springer Series in Advanced Microelectronics, Springer, New York;Liu,2017

2. Effects of width scaling and layout variation on dual damascene copper interconnect electromigration

3. Current-crowding-induced electromigration failure in flip chip solder joints

4. K.N. Tu, Y. Liu, and M. Li, Appl. Phys. Rev., 4 (2017) 011101.

5. Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections

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1. Copper Sintering Pastes with Various Polar Solvents and Acidic Activators;ACS Omega;2023-10-12

2. Interfacial reactions and nucleation of WAl12 phase on electromigration in hydrogen exposed semiconductor interconnects;Applied Surface Science;2023-03

3. Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer;Journal of Alloys and Compounds;2022-12

4. Effect of Ag coating on the oxidation resistance, sintering properties, and migration resistance of Cu particles;Journal of Alloys and Compounds;2022-11

5. Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

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