Copper Sintering Pastes with Various Polar Solvents and Acidic Activators-Reference-Cited by-同舟云学术

Copper Sintering Pastes with Various Polar Solvents and Acidic Activators

Published:2023-10-12 Issue:42 Volume:8 Page:39135-39142
ISSN:2470-1343
Container-title:ACS Omega
language:en
Short-container-title:ACS Omega

Author:

Lee Seungyeon¹,Han Seong-ju¹,Kim Yongjune²,Jang Keon-Soo¹^ORCID

Affiliation:

1. Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong, Gyeonggi-do 18323, Republic of Korea

2. Department of Electrical Engineering, The University of Suwon, Hwaseong, Gyeonggi-do 18323, Republic of Korea

Funder

University of Suwon

National Research Foundation of Korea

Ministry of Trade, Industry and Energy

Korea Institute for Advancement of Technology

INNOPOLIS Foundation

Ministry of SMEs and Startups

Publisher

American Chemical Society (ACS)

Subject

General Chemical Engineering,General Chemistry

Link

https://pubs.acs.org/doi/pdf/10.1021/acsomega.3c04245

Reference30 articles.

1. Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles

2. The rise of conductive copper inks: challenges and perspectives

3. Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints

4. Influence of sintering environment on silver sintered on copper substrate

5. Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-temperature copper sinter-joining technology for power electronics packaging: A review;Journal of Materials Processing Technology;2024-11

2. Solvent-free Cu sintering pastes using acidic activators;Microelectronics Reliability;2024-08

3. Synthesis of Cu Sintering Paste Using Growth of Nanofiber on Cu Microparticles Mixed with Formic Acid;APPL CHEM ENG;2024