Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size
Author:
Funder
JST
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference62 articles.
1. Survey of high-temperature reliability of power electronics packaging components;Khazaka;IEEE Trans. Power Electron.,2015
2. State of the art of high temperature power electronics;Buttay;Mater. Sci. Eng. B,2011
3. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans. Compon. Packag. Manuf. Technol.,2011
4. Metal-metal bonding using Ag metallo-organic nanoparticles;Ide;Acta Mater.,2005
5. In situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron-scale silver paste;Zhang;J. Alloys Compd.,2017
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