On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints-Reference-Cited by-同舟云学术

On the relationship between solder-controlled and intermetallic compound (IMC)-controlled fracture in Sn-based solder joints

Published:2012-04 Issue:8 Volume:66 Page:586-589
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Yazzie K.E.,Xie H.X.,Williams J.J.,Chawla N.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference15 articles.

1. K.C. Ong, V.B. Tan, C.T. Lim, E.H. Wong, X.W. Zhang, in: Proceedings of the 54th IEEE Electronic Components and Technology Conference, 2004, vol. 1, pp. 1075–1079.

2. D. Reiff, E. Bradley, in: Proceedings of the 55th IEEE Electronic Components and Technology Conference 2005, vol. 2, pp. 1519–1525.

3. Z.J. Xu, T.X. Yu, in: EPTC 2008, 10th IEEE Electronics Packaging Technology Conference, 2008, pp. 1080–1085.

4. Impact reliability estimation of lead free solder joint with IMC layer

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