Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference20 articles.
1. Lead-free Solders in Microelectronics
2. Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect
3. Structural and chemical embrittlement of grain boundaries by impurities: A general theory and first-principles calculations for copper
4. Chemistry and bonding changes associated with the segregation of Bi to grain boundaries in Cu
5. Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn–Ag alloy by doping with rare-earth elements
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