Tungsten: sputter deposition and plasma etching

Author:

Franssila Sami

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Initial growth of W-based films deposited on Si studied with ARXPS;Surface and Interface Analysis;2008

2. Wet and Dry Etching Materials;Handbook of Chemicals and Gases for the Semiconductor Industry;2002-07-15

3. Reduction of molybdenum resistivity by a seed layer of TiW;Microelectronic Engineering;1997-11

4. Linewidth uniformity versus etch rate uniformity in refractory metal plasma etching;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1994-09

5. Plasma Etching Characteristics of Sputtered Tungsten Films;MRS Proceedings;1992

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