Stresses, microstructure and resistivity of thin tungsten films deposited by RF magnetron sputtering-Reference-Cited by-同舟云学术

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Stresses, microstructure and resistivity of thin tungsten films deposited by RF magnetron sputtering

Published:1989-09 Issue:1-4 Volume:38 Page:269-285
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Hugon M.C.,Varniere F.,Agius B.,Froment M.,Arena C.,Bessot J.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference14 articles.

1. Characterization of electron‐beam deposited tungsten films on sapphire and silicon

2. Proc. 1985 Workshop on Tungsten and other Refractory Metals for VLSI Applications;Saxena,1986

3. Structure of LPCVD Tungsten Films for IC Applications

4. Tungsten films produced by selective deposition onto silicon wafers

5. Microstructure, growth, resistivity, and stresses in thin tungsten films deposited by rf sputtering

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1. Effects of Substrate Bias and Ar Pressure on Growth of α-phase in W Thin Films Deposited by RF Magnetron Sputtering;Electronic Materials Letters;2022-12-29

2. Modification of track membranes with ion-plasma sputtered tungsten;Materials Research Express;2018-08-03

3. Integration of tungsten layers for the mass fabrication of WO3-based pH-sensitive potentiometric microsensors;Sensors and Actuators B: Chemical;2015-01

4. Characterization and modeling of electrical resistivity of sputtered tungsten films;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2001-05

5. Oxygen-induced amorphous structure of tungsten thin films;Applied Physics Letters;1999-10-11

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