Aging treatment characteristics of solder bump joint for high reliability optical module-Reference-Cited by-同舟云学术

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Aging treatment characteristics of solder bump joint for high reliability optical module

Published:2004-09 Issue: Volume:462-463 Page:402-407
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Kim Kyung-Seob,Yu Chung-Hee,Yang Jun-Mo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Fundamentals of Microsystems Packaging;Tummala,2001

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times;Microelectronics International;2023-04-17

2. Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions;Journal of Electronic Materials;2015-04-01

3. Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification;Journal of Alloys and Compounds;2015-03

4. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys;Journal of Alloys and Compounds;2014-01

5. Analysis of the Test Parameters in the Shear Test of BGA Solder Joints;Key Engineering Materials;2005-11

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