Issues of contact etching and pre-treatment in Schottky contact

Author:

Lee Haksun,Shin Kyoungsub,Cho Nammyun,Min Gyungjin,Kang Changjin,Han Woosung,Moon Jootae

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

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2. Source—Drain contact resistance in CMOS with self-aligned TiSi2

3. High aspect ratio contacts: A review of the current tungsten plug process

4. Quarter-Micron Interconnection Technologies for 256-Mbit Dynamic Random Access Memories

5. M. Sekine, N. Itoh, T. Akimoto, T. Shinmura, D.T.C. Huo, Y. Kakuhara, K. Kajiyana, Y. Yamada, K. Yamazaki, Y. Murao (1992), Extended Abstr. of the Int. Conf. on Solid State Devices and Mater., Tsukuba 184.

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