Crosslinking impact of mesoporous MSQ films used in microelectronic interconnections on mechanical properties-Reference-Cited by-同舟云学术

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Crosslinking impact of mesoporous MSQ films used in microelectronic interconnections on mechanical properties

Published:2006-01 Issue:1-2 Volume:495 Page:124-129
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Ciaramella F.,Jousseaume V.,Maitrejean S.,Verdier M.,Remiat B.,Zenasni A.,Passemard G.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Challenges of back end of the line for sub 65 nm generation

2. N. Chérault, G. Carlotti, N. Casanova, P. Gergaud, C. Goldberg, O. Thomas, M. Verdier, To be published in Microelec. Eng. (2005).

3. Proceeding of the International Interconnection Technology Conference;Leduc,2005

4. Cellular Solids: Structure and Properties;Gibson,1997

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